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Last modified by UT2UK on 2026/04/12 18:32
From version 8.1
edited by UT2UK
on 2026/04/12 16:39
Change comment: There is no comment for this version
To version 10.1
edited by UT2UK
on 2026/04/12 16:43
Change comment: There is no comment for this version

Summary

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... ... @@ -1,10 +1,11 @@
1 +Окей, окей, перевожу. Макросы не трогаю.
2 +Вот перевод:
3 +
1 1  == ==
2 2  
3 3  {{info}}
4 4  == **Can all variants of the original Ermak be upgraded to TT?** ==
5 -
6 6  ----
7 -
8 8  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
9 9  {{/info}}
10 10  
... ... @@ -14,12 +14,12 @@
14 14  
15 15  Yes, all variants. In some cases (the very first revisions with the old BPF block, FW adjustment is required).
16 16  
18 +
17 17  {{info}}
18 -== **What other hardware modules besides the DSP board will require upgrading?** ==
19 19  
21 +== **What other hardware modules besides the DSP board will require upgrading?** ==
20 20  ----
21 -
22 -* **DSP board 1GB DDR3 + 16GB** EMMc **rev 1.3 **
23 +* **DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
23 23  * **Front panel board** with LED backlighting and dual encoders **rev 2.3**
24 24  * **Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
25 25  * **PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
... ... @@ -32,27 +32,27 @@
32 32  * Additional gray button caps (16 pcs.)
33 33  * Headphone and microphone jacks (2 pcs.)
34 34  * LED lightpipes (2 pcs.)
35 -* **CPU heatsink** (1 pc.)
36 -{{/info}}
36 +* **CPU heatsink** (1 pc.){{/info}}
37 37  
38 -== (% class="box infomessage" %)**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
38 +== (% class="box infomessage" %)
39 +**What other hardware modules besides the DSP board will require upgrading?**(%%) ==
39 39  
40 40  ----
41 41  
42 -* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** EMMc **rev 1.3 **
43 -* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
44 -* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
45 -* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
46 -* (% class="box infomessage" %)**New anodized front panel** with laser engraving
47 -* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
48 -* (% class="box infomessage" %)**FPC** cables (2 pcs.)
49 -* (% class="box infomessage" %)**Knobs** for dual encoders
43 +* (% class="box infomessage" %)**DSP board 1GB DDR3 + 16GB** eMMC **rev 1.3**
44 +* (% class="box infomessage" %)**Front panel board** with LED backlighting and dual encoders **rev 2.3**
45 +* (% class="box infomessage" %)**Display board with installed TFT AMOLED 1920×1080** module **rev 1.2**
46 +* (% class="box infomessage" %)**PDB board** (power distribution board) without 6-pin LEMO connector (purchased separately). The 4-pin connector from the previous board can be used. **rev 1.2**
47 +* (% class="box infomessage" %)**New anodized front panel** with laser engraving
48 +* (% class="box infomessage" %)**New adapter cable** for connecting the PDB board (Ethernet + USB2)
49 +* (% class="box infomessage" %)**FPC** cables (2 pcs.)
50 +* (% class="box infomessage" %)**Knobs** for dual encoders
50 50  * (% class="box infomessage" %)Speaker acoustic enclosure (free of charge)
51 51  * (% class="box infomessage" %)Plastic standoffs (12 pcs.)
52 52  * (% class="box infomessage" %)Additional gray button caps (16 pcs.)
53 53  * (% class="box infomessage" %)Headphone and microphone jacks (2 pcs.)
54 54  * (% class="box infomessage" %)LED lightpipes (2 pcs.)
55 -* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
56 +* (% class="box infomessage" %)**CPU heatsink** (1 pc.)
56 56  
57 57  
58 58  
... ... @@ -71,7 +71,7 @@
71 71  [[image:image2025-12-29_15-1-46.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="616" width="705"]] [[image:image2025-12-29_15-2-13.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="600" width="696"]]
72 72  
73 73  (% style="text-align: center;" %)
74 -=== **Display board with installed FullHD 1920x1080 AMOLED display** ===
75 +=== **Display board with installed FullHD 1920x1080 AMOLED display** ===
75 75  
76 76  [[image:image2025-12-29_15-10-58.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="393" width="685"]] [[image:image2025-12-29_15-11-16.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="399" width="686"]]
77 77  
... ... @@ -78,12 +78,12 @@
78 78  === ===
79 79  
80 80  (% style="text-align: center;" %)
81 -=== **PDB board without new LEMO connector** ===
82 +=== **PDB board without new LEMO connector** ===
82 82  
83 83  [[image:image2025-12-29_15-16-39.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="415" width="670"]] [[image:image2025-12-29_15-17-0.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="388" width="681"]]
84 84  
85 85  (% style="text-align: center;" %)
86 -=== **ETH+USB cable** ===
87 +=== **ETH+USB cable** ===
87 87  
88 88  [[image:1775928491503-395.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="826" width="620"]]
89 89  
... ... @@ -105,7 +105,7 @@
105 105  [[image:1775928301785-613.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="833" width="624"]][[image:1775928520924-295.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="467" width="623"]]
106 106  
107 107  (% style="text-align: center;" %)
108 -=== **Knobs for dual encoders (2pcs)** ===
109 +=== **Knobs for dual encoders (2 pcs.)** ===
109 109  
110 110  [[image:1775928649337-110.png||data-xwiki-image-style-alignment="center" data-xwiki-image-style-border="true" height="817" width="613"]]
111 111  
... ... @@ -113,7 +113,7 @@
113 113  === ===
114 114  
115 115  (% style="text-align: center;" %)
116 -=== **Additional buttons caps, plastic stands (12 pcs) and LED pipelights** ===
117 +=== **Additional button caps, plastic standoffs (12 pcs.) and LED lightpipes** ===
117 117  
118 118  [[image:1775928936867-245.png||data-xwiki-image-style-alignment="center" height="584" width="594"]]
119 119  
... ... @@ -182,37 +182,15 @@
182 182  
183 183  {{error}}
184 184  == **Are there any nuances or important things to know before deciding to upgrade?** ==
185 -
186 186  ----
187 -
188 188  **Yes, there are several points to keep in mind:**
189 -
190 190  * The current unstable political and financial situation is affecting the components market and logistics.
191 191  * This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
192 192  * As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
193 193  * Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
194 194  * The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
195 -
196 196  1. Once registration closes, the total number of participants is finalized.
197 197  1. An order is placed with the manufacturer for the remaining boards.
198 198  **Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
199 199  {{/error}}
200 200  
201 -== **Are there any nuances or important things to know before deciding to upgrade?** ==
202 -
203 -----
204 -
205 -**Yes, there are several points to keep in mind:**
206 -
207 -* The current unstable political and financial situation is affecting the components market and logistics.
208 -* This has been especially pronounced in the memory market — due to sharp price spikes, the cost of memory components (DDR3 eMMC) has increased up to 5 times.
209 -* As a result, the configuration had to be optimized: the eMMC capacity was reduced from 32 GB to 16 GB.
210 -* Prices are currently fixed based on quotes already received from Chinese manufacturers, but they may change in the future.
211 -* The first batch of DSP boards (the most expensive and critical component) is being assembled on a pre-order basis:
212 -
213 -1. Once registration closes, the total number of participants is finalized.
214 -1. An order is placed with the manufacturer for the remaining boards.
215 -**Important**: Additional individual upgrades after the batch is formed are **not currently planned**, so it makes sense to decide in advance in order to be included in the current delivery.
216 -
217 -
218 -)))